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Snior Engineer - Technology Development

Responsibilities

  • To┬álead the Thermal Management development, and power durability co-development
  • To drive, develop and prove concepts for next generation thermal management solutions for CSSP package.
  • To implement proven concepts / materials into high volume production capability.
  • To reinvent assembly processes as a result of industrialization of new materials and or new technology for the CSSP package.
  • To setup the metrology and other auxiliary process / tools required for the new process.
  • To support new cross-functional projects that requires thermal and power improvement initiatives within the organization.
  • To provide inputs to novel packaging process development in collaboration with external partners (research institutes / vendors)

Requirements
  • Degree in any Engineering disciplines
  • Experience working in a high-volume manufacturing Semiconductor assembly packaging environment in process development or sustaining.
  • In depth knowledge and hands on experience in semiconductor front end and or assembly processes
  • Able to travel on short notice for extended period on overseas assignments.