Job description:

An experienced and strategic leader to take on the role of Director of Process and Production R&D.

This position is responsible for formulating business strategies, leading engineering teams, and managing cross-functional R&D projects to drive technological excellence and high-volume manufacturing in the semiconductor industry.

Responsibilities:

Develop and execute business strategies and R&D plans aligned with corporate goals.

Plan, manage, and deliver large-scale, cross-regional R&D programs focused on semiconductor process development and volume production.

Provide deep technical leadership across IC wafer engineering, including process areas such as:

• Ion Beam Etching (IBE)

• Reactive Ion Etching (RIE)

• Physical Vapor Deposition (PVD)

• Chemical Vapor Deposition (CVD)

• Atomic Layer Deposition (ALD)

• Photolithography

• Chemical Mechanical Polishing (CMP)

• Electroplating

• Wafer inspection and metrology

Drive R&D of new materials, process modules, and device architectures.

Oversee the establishment and operation of wafer fabrication facilities, including:

• Equipment selection, installation, and qualification

• Wafer production and process ramp-up

• Implementation of intelligent manufacturing systems

• Yield improvement and quality management

Qualifications/Desired skills:

Extensive experience in semiconductor process R&D and high-volume manufacturing environments.

Proven ability to lead multidisciplinary engineering teams and manage complex projects across geographies.

Deep knowledge of IC process technologies, fab equipment, materials, and device integration.

Hands-on experience in fab construction and ramp-up, including equipment procurement and production setup.

Strong leadership, strategic thinking, and cross-functional collaboration skills.

This position requires frequent international travel to support cross-site collaboration, supplier engagement, and fab operations.

Education/Experience:

Master's degree or above in Materials Science, Microelectronics,Electrical Engineering, Physics, Chemical Engineering, or related fields.

Preferred with at least 10 years of industry experience as a supervisor in IC process and fab construction.