R&D Scientist - Co-Packaged Optics (NSTIC), IME
Job post no longer accepts applications
A*STAR RESEARCH ENTITIES
4 days ago
Posted date4 days ago
N/A
Minimum levelN/A
Job Description:
Job Requirements:
The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.
- Development of package-level optical interconnects for advanced Co-Packaged Optics (CPO) platforms using fan-out, silicon interposers, polymer, glass, or 3D stack technologies, interfacing with various optical coupling schemes.
- Simulate the impact of hybrid bonding interfaces, package stacks and other packaging elements on optical signal transmission.
- Design silicon and alternative-material lenses for optical I/Os in wafer-scale integration.
- Estimate optical losses between grating/edge couplers and fiber interfaces via lens structures.
- Design package level/wafer-level optical interconnects between GPU-GPU and GPU-memory for multi-chiplet heterogeneous integration packages.
- Develop passive fiber alignment structures and techniques for high-density optical coupling.
- Evaluate fiber array assemblies with CPO test vehicles.
- Generate package design and test plans to prototype and validate process flows.
- Characterize fabricated structures using optical testing and metrology tools.
- Propose innovative ideas to improve the state of the art in optical interconnects and testing.
Job Requirements:
- MS or Ph.D in Engineering or Physics.
- Strong background in optical interconnect modeling.
- Understanding of passive alignment techniques for fiber-to-chip coupling. (V-grooves, alignment pins, trench structures, etc.)
- Understanding of optical loss mechanisms, alignment tolerances, and packaging-induced misalignments.
- Knowledge in wafer-level processes such as lithography, DRIE, plasma etching, wafer bonding, and dicing.
- Familiarity with photonic packaging platforms (SiPh, InP, TFLN) and coupling interfaces (edge coupler, grating coupler).
- Proficiency with microscope-based alignment, metrology, and optical loss measurements.
- Strong communication, teamwork, and technical reporting skills.
The above eligibility criteria are not exhaustive. A*STAR may include additional selection criteria based on its prevailing recruitment policies. These policies may be amended from time to time without notice. We regret that only shortlisted candidates will be notified.
JOB SUMMARY
R&D Scientist - Co-Packaged Optics (NSTIC), IME
A*STAR RESEARCH ENTITIES
Singapore
4 days ago
N/A
Contract / Freelance / Self-employed
Job post no longer accepts applications
R&D Scientist - Co-Packaged Optics (NSTIC), IME
Job post no longer accepts applications