Job Description: Scientist/Senior Scientist - Process Integrator / Hybrid Bonding/ Heterogeneous Integration

The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Principal Scientist to join our team. This role is pivotal in advancing state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge fabrication techniques for 2.5D and 3D packaging applications, and conducting electrical and reliability characterization. The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.

Key Responsibilities

• Collaborate with senior staff, process integrators, and external partners to address technology roadmaps, process capability requirements, and business challenges.
• Lead high impact projects with manageable risks and mentor less experienced colleagues.
• Conceive and plan projects involving new materials, advanced process integration approaches, and innovative concepts.
• Research and develop advanced packaging technology such as flip-chip & hybrid bonding techniques for 2.5D and 3D IC applications,
• Investigate and refine wafer bonding processes for interposer fabrication, inter-dielectric gap fill, and alignment accuracy, addressing critical factors such as warpage, bonding strength, and yield.
• Optimize die bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods.
• Conduct engineering experiments for process characterization to drive quality and yield improvements.
• Perform reliability characterization of hybrid-bonded packages to ensure robustness and long-term performance.
• Act as a subject matter expert (SME) for both internal and external stakeholders, providing guidance and expertise.
• Inspire and mentor talents in semiconductor technology, contributing to workforce development in the field.
• Work with minimal supervision and should be a team player.

Qualifications and Skills

Candidates should meet the following criteria:

• Educational Background: PhD in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
• Experience: 0 to 5 years of experience in microelectronic devices, circuits, and hybrid component integration, 2.5D/3D heterogenous integration applications.
• Technical Expertise: knowledge in hybrid bonding or flip chip bonding is plus.
• Knowledge: Strong knowledge of hybrid bonding equipment technologies and bonding materials and methodologies, and reliability characterization is preferable.
• Skills: Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments.
• Excellent written and verbal communication abilities.
• Teamwork: Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.
• Demonstrated expertise in heterogeneous integration, hybrid bonding, and advanced packaging processes.
• Proven ability to troubleshoot and resolve process-related challenges.

What We Offer

• The opportunity to work on cutting-edge research in advanced packaging and heterogeneous integration.
• A collaborative and interdisciplinary work environment.
• Access to state-of-the-art facilities and resources.
• File intellectual property (IP) promptly for new research findings.
• Publish research in peer-reviewed journals and present findings at international conferences.
• Join us in shaping the future of semiconductor technologies and heterogeneous integration. Apply today!

Additional Information

• Application Process: Interested applicants should submit a detailed resume, a cover letter outlining their qualifications and experience, and contact information for three professional references. Applications can be submitted through the IME career portal.
• Research Environment at IME: IME provides a dynamic and collaborative research environment, equipped with state-of-the-art 300mm Fabrication facilities and resources. Researchers have access to advanced laboratories and characterisation equipment, fostering innovation and enabling the development of groundbreaking technologies. The institute encourages interdisciplinary collaboration and offers opportunities for professional growth and development.
• Specific Projects: The Principal Scientist will be involved in several high-impact projects, including the development of next-generation 2.5D and 3D packaging technologies, enhancing hybrid bonding processes for improved performance and reliability, and contributing to industry-leading research in heterogeneous integration. Specific projects may include collaborations with leading semiconductor companies and academic institutions.

For further inquiries or additional information, please contact our HR personal. We look forward to receiving your application and exploring the potential for you to join our innovative team.