Job Description:
Advanced Process Modules is a central technology development team providing next-generation unit process solutions to advance specialty technology programs at IME including Advanced Packaging, Micro Electro Mechanical systems, Photonics & Sensors, SiC, and GaN. The candidate will lead a team of research scientists and engineers specializing in Backend of Line (BEOL) unit processes including electroplating, chemical mechanical planarization (CMP), permanent wafer-to-wafer/chip-to-wafer bonding (fusion/hybrid/thermocompression/eutectic bonding) and temporary bonding.

His or her main roles and responsibilities will include the following:

• Lead team to deliver innovations involving process methodologies, materials, or approach, and capture intellectual property related to various aspects of BEOL unit modules.
• Develop balanced team with strong process expertise to execute with agility and deliver high quality, on-time solutions to meet internal and external customer needs.
• Participate in internal and external customer/collaborator meetings, as needed, to provide feasibility assessments during project scoping and problem troubleshooting/solutions.
• Actively participate with program leadership to devise near and medium-term process technology roadmaps to intercept future industry needs
• Identify gaps in process and equipment capabilities and propose new process solutions to meet future challenges
• Maintain good network with equipment/material vendors as well as internal/external collaborators, and lead acquisition of new materials/equipment capabilities through procurement or collaborations.

Job Requirements:

• PhD with specialization in Electrical & Electronics Engineering / Microelectronics / Materials Engineering / Chemical Engineering / Materials Science/ Chemistry / Physics or equivalent.
• At least 8 years of semiconductor industry experience in process engineering functions within a technology development organization, with solid exposure to atleast two or more process areas among electroplating, CMP, and wafer bonding. Exposure to assembly technologies including dicing and backgrinding is a plus.
• At least 3 years of experience leading a team of engineers in a dynamic environment, with demonstrated skills in managing multiple internal and external stakeholders.
• Strong foundational knowledge in advanced packaging/heterogeneous integration or silicon photonics would be a plus.
• Strong interpersonal skills as well as demonstrated skills in collaborating with internal and external stakeholders is necessary.
• At least 5 years of demonstrated experience in managing projects of moderate to high complexity involving cross-functional collaboration is desired.
• Demonstrated ability to navigate multiple projects and stakeholders in a dynamic environment and ability to thrive in ambiguous situations with a "can-do" attitude is highly desired.
• Good analytical/critical thinking skills and oral/written communication skills, with ability to deliver clear and concise messages to leadership teams and internal/external collaborators and customers.
• Self-driven with strong interest in the future of semiconductor technologies, constantly keeping up with industry trends.