Candidate will be part of Far-Backend of Line (Far-BEOL) process module team, advancing specialty microelectronics technologies at IME. His or her main roles and responsibilities include:

• Develop Chip-to-Wafer (C2W) bonding process capabilities using fusion/hybrid/thermocompression/eutectic bonding for photonics heterogeneous integration and advanced packaging applications.
• Lead module loop integration for layer transfer of III-V and other compound materials through C2W bonding and post processing.
• Deliver innovations involving process methodologies, materials, or approaches, and generate intellectual property related to various aspects of heterogeneous integration platforms.
• Participate in discussions with industry partners to align and develop the building blocks required for next generation heterogeneous integration platforms, including equipment capabilities.
• Participate as team member with process integration teams to actively innovate and support bonding process optimization and process troubleshooting for various industry and grant projects.
• Lead and support competitive grant research project proposals and execution of these projects.
• File patents/know-hows on new development activities.
• Actively document and publish research findings in prestigious journals and conferences.

Job Requirement:

• PhD with specialization in Electronic / Microelectronics / Material Engineering / Material Science/ Chemistry / Physics or equivalent.
• 5 years of industry experience in 3D heterogeneous integration and wafer bonding technologies, either in an academic or industrial setting.
• Prior hands-on experience in wafer bonding with in-depth technical knowledge in atleast one or more bonding processes and mechanisms (vacuum bonding, metal-metal bonding, fusion bonding, hybrid bonding, temporary bonding) is required.
• Knowledge silicon photonics, or 3D heterogenous integration technology platforms is preferred.
• Strong experimental design (DOE) and data analysis skills is preferred.
• Good interpersonal skills and strong demonstrated skills in collaborating with internal and external stakeholders.
• Atleast 2 years of demonstrated experience in managing projects of moderate complexity is preferred.
• Good oral and written communication skills, with ability to deliver clear and concise messages to both internal and external stakeholders.
• Self-driven with strong interest in next-generation applications of wafer bonding technologies and industry trends.