He/she will be responsible for Heterogeneous Integration of modules involving wide spectrum of processes such as back-grinding which enables ultra-thin module, dicing which disintegrates the whole device wafer into individual units, integration process which put several components into a working module. Staff will have the opportunity to work with state-of-the-art heterogeneous integration equipment to explore and embark on pathfinding research in advanced electronics modules.

Involves in heterogeneous integration process such as die preparation process (dicing & back-grinding), device integration into a functioning module.

In charge/operation of various equipment for the heterogeneous integration processes to ensure the readiness to support the process in terms of equipment's condition, availability of processing material, and to perform the heterogeneous integration tasks including metrology inspection and data analysis.

Job Requirements:

• Diploma or ITE graduate in Materials Science, Mechanical, Chemical or Chemistry, Electrical or electronics.
• Strong communication, industry awareness, and problem-solving skills.
• Highly motivated to succeed, a self-starter who is driven and able to work with others effectively to get things done.