Job Description: Scientist/Senior Scientist - Process Integrator / Hybrid Bonding/ Heterogeneous Integration

The Heterogeneous Integration Department at the Institute of Microelectronics (IME) is seeking a passionate and skilled Principal Scientist to join our team. This role is pivotal in advancing state-of-the-art chip-to-wafer and wafer-to-wafer hybrid bonding processes, developing cutting-edge fabrication techniques for 2.5D and 3D packaging applications, and conducting electrical and reliability characterisation. The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.

Key Responsibilities

• Collaborate with senior staff, process integrators, and external partners to address technology roadmaps, process capability requirements, and business challenges.
• Lead high-impact projects with manageable risks and mentor less experienced colleagues.
• Conceive and plan projects involving new materials, advanced process integration approaches, and innovative concepts.
• Research and develop advanced packaging technology such as flip-chip & hybrid bonding techniques for 2.5D and 3D IC applications.
• Investigate and refine wafer bonding processes for interposer fabrication, inter-dielectric gap fill, and alignment accuracy, addressing critical factors such as warpage, bonding strength, and yield.
• Optimise die bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, and bonding methods.
• Conduct engineering experiments for process characterisation to drive quality and yield improvements.
• Perform reliability characterisation of hybrid-bonded packages to ensure robustness and long-term performance.
• Act as a subject matter expert (SME) for both internal and external stakeholders, providing guidance and expertise.
• Inspire and mentor talents in semiconductor technology, contributing to workforce development in the field.
• Work with minimal supervision and should be a team player.

Qualifications and Skills

Candidates should meet the following criteria:

• Educational Background: PhD in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
• Experience: 0 to 5 years of experience in microelectronic devices, circuits, and hybrid component integration, 2.5D/3D heterogeneous integration applications.
• Technical Expertise: knowledge in hybrid bonding or flip chip bonding is plus.
• Knowledge: Strong knowledge of hybrid bonding equipment technologies and bonding materials and methodologies, and reliability characterisation is preferable.
• Skills: Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments.
• Excellent written and verbal communication abilities.
• Teamwork: Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.
• Demonstrated expertise in heterogeneous integration, hybrid bonding, and advanced packaging processes.
• Proven ability to troubleshoot and resolve process-related challenges.