Research scientists working on the wafer-to-wafer (W2W) bonding process are primarily responsible for developing, optimizing, and integrating advanced hybrid bonding techniques for semiconductor applications like 2.5D and 3D IC packaging.

Job Description:
Research and Development

• Process Innovation: Leading the design and development of innovative W2W bonding techniques for applications in high-performance computing, AI, and memory.
• Material Science: Investigating and selecting appropriate bonding materials (e.g., low-temperature organic/inorganic materials, Cu/oxide, Cu/polymer) to ensure strong and stable interfaces.
• Parameter Optimization: Optimizing critical bonding parameters such as temperature, pressure, and surface preparation methods (e.g., CMP, plasma activation, cleaning) to achieve high bonding strength, yield, and alignment accuracy.
• Problem Solving: Addressing challenges related to process integration, such as wafer warpage, thermal budget constraints, contamination, and the reduction of thermo-mechanical stress.

Characterization and Analysis

• Process Evaluation: Coordinating and executing comprehensive evaluations of new processes, materials, and equipment.
• Reliability Testing: Conducting electrical, thermal, and mechanical reliability characterization of bonded structures (e.g., using SEM, SAM, AFM) to validate performance and ensure manufacturing guidelines are met.
• Data Analysis: Utilizing metrology tools and data analysis to assess surface topography, void defects, and bond quality, and driving quality improvements based on these findings.

Collaboration and Strategy

• Project Leadership: Conceiving, planning, and leading high-impact projects, often involving external partners and stakeholders.
• Technology Road mapping: Collaborating with senior staff and process integrators to define and address future technology roadmaps and business challenges in advanced packaging.
• Intellectual Property: Generating detailed reports and contributing to the creation of new intellectual property (IPs) and knowledge areas to strengthen the company;s portfolio.
• Mentorship: Inspiring and mentoring scientists, engineers and technicians in advanced semiconductor technologies.

Job Requirements:

• PhD degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.
• Experience in W2W bonding process, with a strong track record in advanced packaging technologies is added advantage.

In essence, a research scientist in W2W bonding works at the forefront of semiconductor packaging, pushing the boundaries of integration density and performance for next-generation electronic devices.