Job Responsibilities

Process Development & Optimization

• Develop and optimize coating processes for photoresist, and dielectric materials (e.g., PID, PI) on package substrates.
• Establish uniform coating parameters to ensure consistent layer thickness and adhesion.
• Optimize oven/thermal curing profiles for soft bake, hard bake, pre-bake, post-exposure bake (PEB), or final curing.

Tool Management & Setup

• Define tool requirements and support installation and qualification of coaters, hot plates, and curing ovens.
• Maintain and troubleshoot coating and baking equipment to ensure uptime and performance.
• Work with equipment vendors and facilities teams on preventive maintenance and upgrades.

Process Monitoring & Control

• Monitor coating quality, film thickness uniformity, and oven cure parameters using metrology tools (e.g., ellipsometry, thickness gauges, bake sensors).
• Implement process control plans, including SPC charts and run-to-run feedback control.
• Validate material compatibility, adhesion strength, thermal stability, and outgassing behavior.

Defect Prevention & Yield Improvement

• Identify and resolve coating and baking-related defects.
• Collaborate with upstream and downstream teams to ensure integrated process stability.

Documentation & Compliance

• Create and maintain technical documentation including SOPs, process specs, recipes, and FMEAs.
• Ensure all processes comply with environmental, safety, and chemical handling standards.

Perform any other ad-hoc duties as assigned by the Manager, as required to support the team and organizational goals.

Job Requirements

Professional Qualifications:

• PhD or Master's degree in Chemical Engineering, Materials Science, Microelectronics, or a related field.
• 5-10+ years of experience in coating and thermal process development in substrate, PCB, or semiconductor manufacturing.
• Familiarity with coating materials such as photoresists, ABF, PI, solder mask, and related chemistries.

Specialized Knowledge & Skills:

• Knowledge of substrate technologies such as Damascene, SAP, ABF build-up, or Embedding.
• Strong analytical and problem-solving skills; experience with DOE and SPC tools.
• Ability to work cross-functionally in a fast-paced, high-volume production or R&D environment.