Senior Manager/Director (R&D Engineering)
SSCK PTE. LTD.
Purpose of the Job:
Key Job Accountabilities:
Scope of the Job:
Required Experience and Qualifications:
- This role will lead the 2.5D/3D Advanced Package Engineering in Singapore
Key Job Accountabilities:
- Provides 2.5D/3D engineering support for New Product Introduction (NPI) and High-Volume Manufacturing (HVM), tailored to the needs of various regional operations and leveraging expertise in product design, processes, equipment, tools, and materials. Oversees pilot and production lines to meet NPI and HVM product objectives and quality targets. Develops and manages plans based on project scope and resource requirements, while tracking metrics and budgets to ensure adequate support for staffing, equipment, and overall operational efficiency.
Scope of the Job:
- Provides supervision to other supervisors/managers who are direct reports.
- Requires communication to large group or high-level constituents.
- Requires verbal and written communication skills to convey complex and/or detailed information to multiple individuals/audiences with differing knowledge levels.
- Overall responsibilities for managing program, budgets, schedules and achievements.
- Regularly determines what needs to be done and is involved with sharing innovative solutions to achieve broad policies and objectives.
- Requires problem solving with multiple approaches
- Provides short term / long term strategic plan
Required Experience and Qualifications:
- Business Degree preferably with post graduate Diploma in HR or its equivalent
- A track record of successful employee relations in a challenging environment, ideally gained in a production and customer service
- Bachelor's degree or higher in Materials, Electronics, Chemical, Physics, or Mechanical Engineering
- Minimum of 10 years of experience in semiconductor arena
- Works experienced for 2.5D/3D Packaging Processes, Characterization, Qualification and HVM which are Sputtering, Lithography, Plating, Si Etch, CVD, CMP, AOI, Wafer Dicing, Backgrinding Chip Attach, TCB, Underfill, Wafer Mold processes
- Solid understanding of wafer FAB and Packaging processes and tools
- Technical benchmark, risk assessment & Product design guide
- Knowledge of Statistical Data Mining, FMEA, FA and Reliability
- Proficient in Microsoft Office, Jmp and CAD
JOB SUMMARY
Senior Manager/Director (R&D Engineering)
SSCK PTE. LTD.
Singapore
9 days ago
N/A
Full-time
Senior Manager/Director (R&D Engineering)