JOB DESCRIPTION

Advanced Packaging Program at the Institute of Microelectronics (IME) is seeking a passionate and skilled Scientist or Senior Scientist to join our team. The candidate will be responsible to advance the state-of-the-art chip-to-wafer and wafer-to-wafer fusion/hybrid bonding capabilities, develop 2.5D interposer and 3D chip stacking process integration flows for Heterogenous Integration of chiplets for Artificial Intelligence and High-Performance Computing applications, and conducting electrical, thermal and mechanical reliability characterization. The position provides an exciting opportunity to contribute to groundbreaking technologies and collaborate with a dynamic team of researchers and external stakeholders.

Key Responsibilities

• Conceptualise and lead internal capability development and external industry projects involving new materials, advanced process integration approaches, and innovative concepts.
• Lead multi-disciplinary project team for the execution of industry projects with manageable risks and mentor less experienced colleagues.
• Engage and manage internal and external stakeholders for the R&D projects execution and provide timely updates for timely deliverable.
• Conduct research and develop advanced fine-pitch flip-chip & hybrid bonding techniques for chip-to-wafer, emphasizing bonding parameter optimization and process enhancements.
• Investigate and refine wafer bonding processes for interposer fabrication, inter-dielectric gap fill, and alignment accuracy, addressing critical factors such as warpage, bonding strength, and yield.
• Optimize die-bonding processes, including the selection of low-temperature organic and inorganic bonding materials, surface preparation, bonding materials and bonding methods.
• Conduct engineering experiments for process characterization to drive quality and yield improvements.
• Act as a subject matter expert (SME) for both internal and external stakeholders, providing guidance and expertise.
• Collaborate with senior staff, process integrators, and external partners to address technology roadmap and process capabilities development.
• Inspire and mentor talents in semiconductor technology, contributing to workforce development in the field.

JOB REQUIREMENT/Qualifications

• PhD in Materials Science and Engineering, Mechanical or Chemical Engineering, Electronics, Electrical and Computer Engineering, or a related field.
• 5 to 10 years of experience in device fabrication, back-end-of-line (BEOL) and advanced packaging processes & integration required for 2.5D/3D heterogeneous integration applications. Project and stakeholder (including industry partners) management experience will be added advantage.
• Hands-on experience in BEOL wiring processes & integration, C2W/W2W fusion/hybrid bonding and flip-chip bonding are required.
• Strong knowledge in advanced packaging technologies in particular hybrid bonding equipment, bonding materials, processes & integration, and reliability characterization are preferable.
• Strong analytical and problem-solving skills. Proficiency in data analysis and interpretation and design of experiments. Proven ability to troubleshoot and resolve process-related challenges. Excellent written and verbal communication abilities.
• Ability to work collaboratively in a research-oriented environment (OEMs, customers, and Internal stakeholders). Demonstrated ability to manage multiple tasks and projects simultaneously.