About GlobalFoundries:

GlobalFoundries is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world's most inspired technology companies. With a global manufacturing footprint spanning three continents, GlobalFoundries makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit www.gf.com .

Summary of Role:

GlobalFoundries is seeking an experienced 3D Heterogeneous Integration (3DHI) R&D Engineer to drive thermal solutions for next-generation hybrid bonding development.

Essential Responsibilities:

• Lead 3DHI process development efforts for establishing thermal solutions required for advanced packaging solutions needed in the product lines (e.g. , multi-die stacking, fine pitch hybrid bonding, etc.) and planning by working with the unit process engineers, manufacturing engineers, as well as directly with the tools & materials for the GF Singapore semiconductor fabs.
• Drive end-to-end process integration and planning to enable new capability planning, early product prototyping and qualification across multiple programs.
• Develop expertise in the processes, materials and tooling leveraging available characterization resources. Develop integration schemes to continuously improve yields and to reduce cycle time & costs.
• Collaborate with vendors and OSATs (Outsourced Assembly and Test) to develop new wafer level and die level 2.5D and 3DHI processes.
• Drive understanding of failure modes.
• Facilitate advanced packaging interactions between the GF Singapore Product Line/Fab teams and customers.
• Generate IP related to novel wafer integration & packaging technology.

Other Responsibilities:

• Perform all activities in a safe and responsible manner and support all Environmental, Health, Safety & Security requirements and programs.
• Take part in hiring of other Advanced Packaging team members in Singapore.
• Mentor and guide new hires to assume their roles and responsibilities.
• Other duties as assigned by manager.

Required Qualifications:

• Education - Master's in Electrical Engineering, Mechanical Engineering, Chemical Engineering, Materials Science or related field from an accredited degree program.
• MS degree with at least 10 years of prior related work experience.
• Language Fluency - English (Written & Verbal).
• Travel - Up to 20%.

Preferred Qualifications:

• Education - PhD education level preferred with at least 8 years of prior related work experience.
• Demonstrated prior leadership experience in the workplace, school projects, competitions, etc.
• Project management skills, i.e. the ability to innovate and execute on solutions that matter; the ability to navigate ambiguity.
• Strong written and verbal communication skills.
• Strong planning & organizational skills.