Role:

As a Product Marketing and Application Manager, you will communicate the value proposition of ASMPT SMT Advanced Packaging solutions to customers and prospects. Your goal is to increase ASMPT market share, achieve financial targets and improve customer satisfaction and loyalty.

Responsibilities:

• Serve as the subject matter expert on ASMPT SMT Advanced Packaging solutions
• Support customer engagement by the sales team, provide answers to technical queries, perform cycle time calculations and support Technical Review Meetings
• Lead project management and provide on-site support for evaluations at customer sites
• Collaborate with the global team from various departments to meet customer evaluation requirements
• Conduct product demonstrations, proof-of-concept studies, sales and application training
• Communicate Rest of Asia (ROA) "Voice of Customer" to Global Product Management team and monitor competitors to improve competitiveness of product portfolio
• Contribute to ROA SMT Center of Competence (COC) as the preferred go-to partner for customers and partners, offering expertise in Process, Simulations, Product demonstrations and improvement programs
• Perform any other ad-hoc duties as assigned

Requirements:

• Bachelor's Degree in Engineering
• Minimum 3 years of relevant work experience
• Minimum 2 years of experience in Semiconductor Manufacturing Process. Familiarity with die bonding equipment desirable including knowledge of Chip-on-Wafer, Embedded substrates and Fan-Out
• Experience in SIPLACE placement machine is an added advantage
• Proven ability to communicate successfully with global customers and counterparts
• Demonstrated good track record of managing and implementing change
• Project management skills are preferred
• Ability to work in a diverse and multicultural environment
• Willingness to travel domestically and internationally as required