Process Engineer (Flip chip and Direct Die Attach)
LINXENS SINGAPORE PTE. LTD.
3 days ago
Posted date3 days ago
N/A
Minimum levelN/A
EngineeringJob category
EngineeringJob description
Process Parameters Definition, Qualification, and Compliance with Industrialization Performance Standards
New Product Introduction
Job requirements
Process Parameters Definition, Qualification, and Compliance with Industrialization Performance Standards
- Lead and organise activities related to Direct Die Attach (DDA) / Flip Chip and Die Attach operations to support new product industrialization, optimizing production efficiency while complying with quality standards, cost, schedule, safety and environment
- Subject Matter Expert for advanced Direct Die Attach (DDA) / Flip Chip and Die Attach technology
- Prepare and review equipment specifications, select appropriate potential suppliers based on objective criteria
- Supervise related manufacturing line setup and commissioning
- Define machine process parameters and work instructions
- Lead Process Qualification ( Installation Qualification (IQ) , Operational Qualification (OQ) , Performance Qualification (PQ) for the installed manufacturing line/ equipment
- Execute gap analysis
- Manage with Engineering /Maintenance and Operations to release new manufacturing line to operations (including standards, instructions, and OCAP etc)
- Perform gap analysis (machine, workforce, skill sets) in accordance with operations and quality requirements and implement improvement actions accordingly
- Continuous improvements - Identify and implement cost saving initiatives related to packaging materials, labor efficiency, integration of process, handling, etc
New Product Introduction
- Participate in new product introduction to deliver new products to market
- Analyze the manufacturing options vs. product requirements
- Understand current standards in substrate and packaging processes and propose optimization of company design for manufacturability, focusing in Direct Die Attach (DDA) / Flip Chip and conventional Die Attach applications
- Contributes to defining new packaging solutions for RFID and Smartcard, enabling better mechanical, thermal or electrical performance on the targeted applications
- Interfaces with other engineering functions to coordinate the release of new products and/ or product improvements
- Launches, releases, approves, implements or issues engineering change requests whenever required
- Performs Process Failure Mode, Effects and Criticality Analysis when working with New Product Development
Job requirements
- Bachelor's degree in Engineering / Electronics / Electronics packaging or equivalent
- At least 3 years of experience in Direct Die Attach / Flip Chip packaging
- Strong knowledge and understanding in Flip Chip and Die Attach technologies in IC packaging industries
JOB SUMMARY
Process Engineer (Flip chip and Direct Die Attach)
LINXENS SINGAPORE PTE. LTD.
Singapore
3 days ago
N/A
Full-time
Process Engineer (Flip chip and Direct Die Attach)