Job Description
In your new role you will:

• Understand the automotive application and product needs (incl.mid-/long-term aspects) and translate into package platform requirements
• Challenge and harmonize the requirements across all stakeholders
• Trigger and follow-up on package solution feasibility studies, innovation and pre-development projects
• Assess and propose the complexity of development projects in close cooperation with the package development teams.
• Align all technical, cost and quality aspects with BU, QM and project teams
• Continuous Market screening (competitor/ subcontractor package portfolio) in cooperation with Reverse Engineering
• Identify business opportunities enabled by new packaging technologies and concepts together with Application Engineering
• Provide automotive package platform roadmap and inputs to OSAT and BE package roadmap and FE/BE unit process roadmap
• Contact for all package-relevant topics within ATV

Your Profile
You are best equipped for this task if you have:

• Degree in electrical-/electronics engineering, material science, physics
• More than 5 years of working experience in semiconductor or automotive industry
• Deep understanding of QFN, QFP and/or laminate package BoM construction and materials and the related production methods/processes
• Experience in working with cross-functional international teams, especially in Asia
• Effective communication and presentation skills, with the ability to engage major stakeholders.
• Strong problem-solving and decision-making skills through team collaborations, and manage technical challenges openly, cooperatively, and proactively.
• Fluent in English