Job Description

The Principal / Senior Engineer for New Product Introduction - Wafer Technology is responsible for overseeing semiconductor technology development and implementation. This role demands exceptional technical expertise to ensure the successful transition of products from concept to mass production.

• Lead NPI process from Concept to Mass Production at Foundry (especially BCD, RF-CMOS), ensure collaboration between design, engineering, and manufacturing teams to maximize semiconductor technology optimization.
• Ensure compliance with design rules and specifications while planning and evaluating silicon characterization results.
• Develop and implement robust qualification processes, including the establishment of wafer acceptance criteria and comprehensive testing protocols.
• Lead yield improvement initiatives through in-depth analysis of test data and resolution of issues encountered during the NPI process.
• Produce comprehensive reports detailing project status, potential risks, and key milestones; execute thorough risk assessments for foundry excursions and return material authorizations.
• Implement and oversee sophisticated data exchange protocols between foundry, Outsourced Semiconductor Assembly and Test (OSAT) providers, and Continental to facilitate effective yield monitoring and quality control.
• Drive continuous improvement in wafer technology processes, identifying opportunities for enhanced efficiency, cost reduction, and quality improvement.
• Develop and maintain strong relationships with key suppliers and technology partners, staying abreast of industry trends and emerging technologies in semiconductor manufacturing.

Qualifications

• Degree in Electronics/Electrical Engineering (or relevant) with minimum five years' working experience in semiconductor (e.g., process or product), or subcon management (e.g., Foundries or OSAT).
• Good knowledge in semiconductor manufacturing processes (e.g., wafer process technologies and package assembly), electronic testing (e.g., DFT, Test Hardware, Test Development) and automotive electronic qualification requirements (e.g., AEC-Q100/101).
• Preferable with strong technical proficiency in wafer manufacturing, process integration and/or device engineering.
• Good interpersonal and communication skills (e.g., Business English, Presentations) to interact with internal and external stakeholders.
• Strong problem-solving skills, results oriented and a quality-focused mindset.
• Team player with proactive attitude, able to work independently and travel frequently.