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Staff Engineer, Assembly Process Development & Testing(Co-Packaged Optics)


SAMSUNG ELECTRONICS SINGAPORE PTE. LTD.
8 days ago
Posted date
8 days ago
N/A
Minimum level
N/A
Full-timeEmployment type
Full-time
POSITION OVERVIEW:

Samsung Electronics Device Solutions is a global leader in Advanced Packaging Technology. Successful candidates will support the research and development of advanced packaging activities in the Singapore research center together with R&D teams in headquarter Korea and other countries.

JOB RESPONSIBILITIES:

  • Lead process development and optimization of FAU attach process including both passive and active alignment, epoxy dispensing, FAU bonding and UV/thermal curing process.
  • Must be able to do hands-on and operate active alignment machine for sub-micron precision alignment and coupling process, epoxy dispensing and curing process.
  • Support data collection, root-cause analysis and yield improvement efforts related to optical coupling, FAU to Receptacle optical coupling repeatability test and FAU attach process issues.
  • Performs all hands-on machine operation, troubleshooting, calibration and maintenance of active alignment bonder.
  • Introduce and evaluate new gripper/pickup tool design (e.g pickup gripper), fixture design and other tooling necessary to develop new optical product.
  • Create process FMEA and process control specification.
  • Work closely with machine vendors to further modify and improve existing machine capability and features to better support CPO related projects
  • Design and implement optical test tooling and procedures to quantify coupling loss of FAU coupled OE/CPO packages/assemblies


QUALIFICATIONS & REQUIRED SKILLS:
  • Degree /Masters in Electrical/Electronics Engineering. PhD is a plus.
  • At least 5 years of working experience in assembly processes.
  • Excellent knowledge and experience in flip-chip package development, wirebond, die attach, FAU attach and substrate review.
  • Excellent understanding of optical alignment principles, FAU to PIC chip coupling methodology (edge and grating), epoxy material properties and selection criteria and die bonding process development knowledge.
  • Prior knowledge and experience in 3D printing of polymer/resin material is an added advantage.
  • Excellent problem solving, communication and cross functional collaboration skills.
  • Able to work independently, or work in a team to identify and solve complex problems.
  • Literacy in Korean is an added advantage.
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JOB SUMMARY
Staff Engineer, Assembly Process Development & Testing(Co-Packaged Optics)
SAMSUNG ELECTRONICS SINGAPORE PTE. LTD.
Singapore
8 days ago
N/A
Full-time

Staff Engineer, Assembly Process Development & Testing(Co-Packaged Optics)