Staff Engineer, Assembly Process Development & Testing(Co-Packaged Optics)

SAMSUNG ELECTRONICS SINGAPORE PTE. LTD.
8 days ago
Posted date8 days ago
N/A
Minimum levelN/A
EngineeringJob category
EngineeringPOSITION OVERVIEW:
Samsung Electronics Device Solutions is a global leader in Advanced Packaging Technology. Successful candidates will support the research and development of advanced packaging activities in the Singapore research center together with R&D teams in headquarter Korea and other countries.
JOB RESPONSIBILITIES:
QUALIFICATIONS & REQUIRED SKILLS:
Samsung Electronics Device Solutions is a global leader in Advanced Packaging Technology. Successful candidates will support the research and development of advanced packaging activities in the Singapore research center together with R&D teams in headquarter Korea and other countries.
JOB RESPONSIBILITIES:
- Lead process development and optimization of FAU attach process including both passive and active alignment, epoxy dispensing, FAU bonding and UV/thermal curing process.
- Must be able to do hands-on and operate active alignment machine for sub-micron precision alignment and coupling process, epoxy dispensing and curing process.
- Support data collection, root-cause analysis and yield improvement efforts related to optical coupling, FAU to Receptacle optical coupling repeatability test and FAU attach process issues.
- Performs all hands-on machine operation, troubleshooting, calibration and maintenance of active alignment bonder.
- Introduce and evaluate new gripper/pickup tool design (e.g pickup gripper), fixture design and other tooling necessary to develop new optical product.
- Create process FMEA and process control specification.
- Work closely with machine vendors to further modify and improve existing machine capability and features to better support CPO related projects
- Design and implement optical test tooling and procedures to quantify coupling loss of FAU coupled OE/CPO packages/assemblies
QUALIFICATIONS & REQUIRED SKILLS:
- Degree /Masters in Electrical/Electronics Engineering. PhD is a plus.
- At least 5 years of working experience in assembly processes.
- Excellent knowledge and experience in flip-chip package development, wirebond, die attach, FAU attach and substrate review.
- Excellent understanding of optical alignment principles, FAU to PIC chip coupling methodology (edge and grating), epoxy material properties and selection criteria and die bonding process development knowledge.
- Prior knowledge and experience in 3D printing of polymer/resin material is an added advantage.
- Excellent problem solving, communication and cross functional collaboration skills.
- Able to work independently, or work in a team to identify and solve complex problems.
- Literacy in Korean is an added advantage.
JOB SUMMARY
Staff Engineer, Assembly Process Development & Testing(Co-Packaged Optics)

SAMSUNG ELECTRONICS SINGAPORE PTE. LTD.
Singapore
8 days ago
N/A
Full-time
Staff Engineer, Assembly Process Development & Testing(Co-Packaged Optics)