Lead Process Engineer - CPO & Testing

Overview:

Contribute to advanced packaging R&D for Co-Packaged Optics (CPO), collaborating with global teams. The role involves hands-on process development, optical alignment, tooling design, and machine optimization to drive yield improvements and technical innovation in Fiber Array Unit (FAU) attachment.

Key Responsibilities:

• Lead FAU attach process development (passive/active alignment, epoxy dispensing, bonding, curing)
• Operate and maintain sub-micron active alignment machines
• Perform root-cause analysis, yield improvement, and data collection
• Design new pickup tools, fixtures, and test jigs for optical assemblies
• Work with vendors to enhance machine performance for CPO projects
• Draft FMEA, process control specs, and coupling loss test procedures

Requirements:

• Degree/Master/PhD's in Electrical/Electronics Engineering
• ≥5 years experience in semiconductor assembly processes
• Strong knowledge in flip-chip, wirebond, die attach, FAU-to-PIC coupling
• Familiarity with epoxy materials, optical alignment, and bonding techniques
• Advantage: 3D printing experience of polymer/resin-material
• Strong analytical, hands-on, and cross-functional collaboration skills