Position Summary

The Equipment Associate Engineer (Backend) is responsible for maintaining and supporting backend equipment operations, including setup, repairs, and preventive maintenance. The job incumbent is expected to work closely with engineering and manufacturing teams on equipment qualification, new product introduction, and continuous improvement initiatives.

Responsibilities

• Responsible for maintenance and repairs on any of the following equipment at backend operations such as Laser Marking, Ball Attach, Reflow Oven, Dicing, AOI, Tape and Reel and Packing station.
• Provide line sustaining supports to manufacturing such as machine conversion, device setup and jig and tool maintenance.
• Perform, update and document equipment preventive maintenance in-accordance to process and equipment specification.
• Support engineering group on device and recipe creation, equipment buy-off, evaluation, qualification and new product introduction.
• Participate and contribute in continuous improvement activities for yield, equipment modification and productivity improvement.

Requirements

• Diploma in Electrical/ Electronics/ Mechanical/ Mechatronics/ Chemical/ Material Science or equivalent.
• Strong interest in semiconductor backend processes and equipment.
• Prior hands-on experience and knowledge in semiconductor backend operations or similar high-volume manufacturing environments would be advantageous.
• Understanding of equipment operation principles (e.g., Laser Marking, AOI, Dicing, Reflow, or Packaging) is a plus.
• Strong problem-solving skills, ability to work independently and collaboratively in cross-functional teams.
• Good communication and documentation skills; able to read and interpret equipment manuals, specifications, and technical drawings.