Your responsibilities will include, but are not limited to, the following:

• Identify and quantify key module deficiencies and technology gaps. Lead cross-functional teams to address these issues. Improve current process flows and develop innovative solutions to meet product requirements and manufacturability.
• Develop or redefine CSPEC criteria for optimal product performance and drive activities to ensure manufacturing process capability.
• Coordinate activities at the manufacturing site to secure funding for experiments, and conversions, and effectively communicate decisions to relevant R&D, Product Engineering, and Manufacturing partners.
• Undertake development projects to evaluate and implement new integration schemes for alpha and derivative part types. Establish proof of concept for future tech nodes at the manufacturing facility.
• Take on a leadership role at quarterly yield summits and monthly program reviews to summarize complex problems, explain actions taken to address them, and align R&D, Manufacturing, and senior management teams.
• Assist in the transfer of new technology from R&D to manufacturing. Contribute to ensuring a successful ramp-up and qualification. Support the transfer, documentation, and training of module fundamentals into manufacturing.

Successful candidates for this position,

Must have:

• Passionate about semiconductor technology and innovation.
• Adept at data analysis, problem-solving, and process integration optimization.
• Excellent communication skills and ability to work in cross-functional teams.
• Committed to quality, collaboration, and continuous improvement.
• Ability to be self-motivated, and self-governing with proven ability to work in a demanding & dynamic environment.
• Ability to travel for extended periods to the US for collaborative R&D work

Experiences as below:

• Minimum of 7 years of experience in the Semiconductor industry in the areas of Process Integration and Yield Enhancement.
• Proficiency in scripting/programming/engineering/business intelligence/Analytics software, such as Python, SolidWorks, Tableau, Power BI, etc. is desirable.
• Prior experience in developing strong holistic end-to-end understanding of particular PI modules on new NAND technologies and related structural & electrical fail mechanisms.
• In-depth knowledge and direct experience with CMOS along with good understanding of the process flow, the interaction of process & device, CMOS Device Physics, common yield & reliability issues are desirable.
• Exposure to R&D and transfer/manufacturing is desirable.

Education :

BS, MS/PhD in Electrical Engineering, Microelectronics, Chemical Engineering, Material Science

Develops new or modified process formulations, defines processing or handling equipment requirements and specifications, and reviews processing techniques and methods applied in the manufacture, fabrication, and evaluation of products. Involvement may begin at any step from pilot plant to full-scale manufacturing. Coordinates design requirement review with appropriate engineering/scientific personnel to ensure compatibility of processing methods. Compiles and evaluates test data to determine appropriate limits and variables for process or material specifications. May conceive and plan projects involving definition and selection of new concepts, equipment automation technology, and approaches in the processing or development of new or improved processes.