We are looking for a highly motivated Engineer or Senior Engineer to join our Quantum Hardware Integration team. You will be at the forefront of next-generation quantum packaging technologies, focusing on surface ion trap process integration and the development of superconducting Through-Silicon Vias (TSVs). This role involves close collaboration across disciplines to drive innovation in scalable quantum computing solutions.

Key Responsibilities

• Develop and optimize process flows for surface ion trap technology platforms, with a focus on integration and manufacturability.
• Manage and monitor development lots through fabrication, ensuring alignment with project milestones and technical requirements.
• Identify and troubleshoot process-related issues during development and implementation phases.
• Analyze experimental data, prepare technical reports, and contribute to technical publications or patent filings.
• Collaborate with equipment vendors, materials suppliers, and internal stakeholders to advance process integration and meet customer technology roadmaps.

Requirements

• Bachelor's degree (or higher) in Electrical Engineering, Quantum Engineering, Materials Science, or a related field.
• Understanding of semiconductor process flows and integration concepts.
• 1-3 years of relevant experience in semiconductor fabrication or quantum hardware development is added advantage.
• Strong analytical and problem-solving skills; hands-on approach to experimental work.
• Clear and effective communicator; able to work collaboratively in cross-functional teams.
• Self-starter with a passion for innovation in quantum technologies.