As a Principal Engineer Lead in Singapore for the NAND Technology Integration group, you will be responsible for developing the node, meeting TD milestones for functionality and yield, transferring the node to HVM and supporting node ramp and qualification in HVM. You are expected to closely collaborate with F10 HVM team for node transfer, ramp and qualification. You will lead a team of enthusiastic and talented engineers solving complex problems to develop industry leading NAND technology to support Micron's product strategy. You will need to collaborate closely with partner groups like ANT, TD process, cell, design, reticle and mask, probe, yield and product engineering to co-optimize product and process to achieve these goals.

You must be able to engage and manage a highly technical group that provides and implements high quality solutions to problems in a very fast paced and changing environment.

Teamwork and the ability to communicate very complex problems and issues to both internal and external groups are essential to your success.

Responsibilities Include:

• Enable new process node startup, functionality demo, yield, transfer, qualification, and ramp
• Set technical direction using thorough knowledge of process and material integration, a thorough understanding of the architecture, layout, inline and electrical metrics to obtain results
• Lead the team in setting up structural specs and process requirements by understanding structure-to-electrical interaction, past node learning and competitor benchmarking data. Help define and refine requirements as necessary.
• Cost competitiveness - accelerate path to Micron's technology and cost leadership in the industry.
• Hire, develop, mentor and manage a team of integration engineers of varying experience and GJS levels
• Manage performance and provide regular feedback. Provide guidance, develop, and coach the team members to be ready to excel to the next level. Lead the team by example.
• Develop and utilize key metrics for feedback on a new technology with continual optimization and improvement
• Create a culture of innovation and tenacity within the group to meet the needs of accelerated technology cadence. Lead and initiate innovation projects through patents and technical papers. Promote growth mindset across the organization.
• Drive cross-functional teams to address performance deficiencies and technology gaps. Continuously engage with engineers and leaders from cross functional teams across TD and TPG, and collect feedback to set development strategies towards enhancing module capability.
• Regularly update the status of projects to senior management.
• Take on a leadership role at summits and program reviews in summarizing complex problems, driving, and explaining actions taken to address them and getting alignment across TD, manufacturing, and senior management.
• Aid in setting strategy for future process direction

Qualifications:

• Master's Degree in a relevant Engineering discipline - Electrical, Material Science, Chemical, Physics or related disciplines
• Must have a minimum of five years' experience in semiconductor processes and strong organizational and technical skills with demonstrated success in engagement with worldwide teams.
• Familiarity with NAND architecture, process, operation, cell, testing, and design preferred
• Strong written and verbal communication skills with a proven ability to effectively communicate complex technological issues to senior leaders
• Must have demonstrated the ability to solve problems across multi-functional groups, both within and outside their department/Site
• Must have a proven capability in dealing with complexity, decision making with a small data set and an ability to utilize resources effectively to bring clarity to required actions
• Demonstrated ability to take calculated risks challenging oneself and others to execute on new solutions.
• Prior experience working with HVM team for technology transfer, yield ramp and qualification