Job Description:

Research Engineer will be part of heterogeneous integration group focused on development of the advanced packaging technology platforms for multi-chip and high-density FOWLP. He/she will work on the following tasks:

• Process development for multi-chip and high density FOWLP for various applications such as Chiplets packaging for high power computing, Co-package Optics, Power devices etc.
• Plan and perform DOEs for various process development and materials evaluation for FOWLP
• Establish integration flows for advanced packages
• Coordinate and support engineering build of new packages and development
• Work with industry partners and multidisciplinary team members to execute assigned tasks and resolve issues for projects
• Publish new findings and technological advancement in prestigious journals and overseas/local conferences.

Job Requirements

• University degree or Masters in Electronics / Microelectronics / Material Engineering / Material Science / Chemistry / Physics.
• Prior experience in developing wafer level packaging and fan-out wafer level packaging
• Knowledge of advanced packaging technologies such as photolithography, ECP, PVD, plasma and wet etching is preferred
• Good analytical, communication and presentation skills