As a NAND Technology Integration (NTI) engineer at Micron Technology, Inc., you will be part of a word-wide team responsible for driving next-generation technology from R&D to high volume manufacturing. You will be responsible for leading a multi-disciplinary team of engineers to deliver industry leadership for performance and cost with aggressive timelines.

Responsibilities

• As a 3D NAND process integration engineer, you will take ownership of one or more process modules related to the development and operation of a 3D NAND semiconductor integrated circuit.
• Set up structural specs and process requirements for the module
• Set a clear direction and vision for the module and have a well-defined continual improvement plan.
• Be proactive in identifying potential structure, electrical and reliability issues and addressing them early with process control.
• Focus on structural development, electrical performance, parametric verification, and process control and manufacturability assessment and optimization.
• Analyze materials physically, electrically, etc. and work with process groups, etc to select new material for development. Drive the material changes from research into production.
  Provide team leadership in module development with assembling and coordinating a development team including process engineers, etc.
• Make key decisions for the team, as well as provide clear direction, goals and metrics for success of the team.
• Set up and execute device and process experiments to perform process development and process integration. Extract, analyze, report and draw logical conclusions on experiments and clarify the statistical significance of the data.
• Innovate to address complex problems through both design and process. And consider new options for improving and developing new technologies or devices. Patent disclosures are expected on a regular basis.
• Coordinate activities such as reticle tapeouts, flow/traveler changes, lot management, etc. across cross-functional teams to enable a project to proceed in a rapid and low error manner.
• Support the transfer of new technology from technology development fab to manufacturing fab.
• Communicate key information and projects via presentations and group discussion and drive decisions.
• Continually grow technical and management skills and pursue continued education via on-job training and training class.

Job Requirements

Qualifications

• PhD or M.S. in Electrical Engineering, Microelectronics, Physics, or Material Science Engineering, Bachelor of Science with at least 10 years of relevant experience
• Prior integration and cross-functional project management experience highly preferred.

Selection Criteria

• Ability to derive construction specifications based on correlating electrical and inline metrics based on unit processes and design rules.
• Ability to design, execute and analyze experiments necessary to meet engineering specifications based on structure to electrical correlations.
• Ability to Solve problems with a model-based approach and drive technical innovation through process improvements, patents or technical papers.
• Understand semiconductor device physics and electrical characterization methods including probe, ESDA, param and reliability.
• Experience in data analysis through JMP, Python or other data engineering software.
• Strong interpersonal, oral and written English communications-skills.