Introduction

Develop process flows and process recipes to enable meeting the product requirements for performance, reliability and defect free manufacturing

Your Role

• Driving the development (design and process) of new differentiated technologies such as RF devices, advanced sensors, advanced packaging, and niche products as added features.
• Encourage elegant solution through innovation and out-of-the-box data-driven approach to solve development issues.
• Execute the experimental splits to optimize the process margin and demonstrate the functionality and manufacturability of the new differentiated technologies
• Run DOE and design experimental split plans for various tape-outs/products
• Identify and resolve process integration issues and ET related problems
• Maintained a strong collaborative work with cross functional team for development and qualification of the new technology.
• Driving towards technology milestones releases for mass production.
• Shows mastery of many aspects within one technical discipline, with group-wide recognition as a senior member of a technical team.
• Initiative and creativity result in significant changes to existing processes and methods, leads development and implementation.
• Solves complex, novel and non-recurring problems.
• Contributing inventor on a few patents
• Contributes to conference or journal publications

Accountability

• Works on small projects or on sets of tasks of large projects and assignments.
• Trains and guides others in the own work area on technical skills as needed; ability to break down information for internal and external customers in a systematic and communicable manner.
• Participates in and/or leads (project) teams

Relationship Focus

• Limited and supervised contact at engineering level.
• Maintains awareness of industry trends.
• Actively engages with suppliers (demos, in-house work).
• Attends consortia technical reviews.

Required Qualifications:

• Bachelor's degree with 5 years' experience, master's with 3 years' experience or Ph.D. with 2 years' experience.
• Specialized knowledge, imaginative thinking and sophisticated analytical techniques.
• Strong understanding of RF/CMOS device physics and electrical characterization
• Fluent in English Language both written & verbal and good presentation skills
• Requires a technical (University) degree. (Exceptions approved by local HR).
• Knowledge on wafer bonding, TOS, TOV, and hybrid wafer bonding will be a plus for this job position
• Knowledge on silicon micro-fabrication processes such as Litho, Etch, PVD, etc will be an added advantage
• Good interpersonal skill, tactful, resourceful, possess initiative, good presentation skills
• Strong analytical, presentation and problem-solving skills using statistical tools such as JMP
• Able to perform under face paced and challenging environment