Etch Process Engineer - R&D

The Etch Process Engineer supports research and development by designing, developing, and optimizing plasma etch and wet etch processes for advanced materials, device integration, and next-generation packaging technologies. The role involves hands-on process development, thin-film characterization, and data-driven decision-making, leveraging AI/ML for faster optimization, predictive analysis, and improved process robustness.

Key Responsibilities:

Process Optimization

• Develop, qualify, and optimize plasma etch (dry etch) and wet etch processes for R&D, prototyping, and early-stage technology enablement.
• Characterize etch profiles, selectivity, uniformity, CD control, and surface quality using industry-standard metrology tools.
• Design and execute DOE experiments to identify key process parameters, reduce variability, and improve process stability.
• Apply AI/ML techniques (e.g., predictive modeling, pattern recognition, clustering) to accelerate process tuning and optimize etch performance.

Data Analytics & Process Control

• Monitor, analyze, and control etch performance using SPC, statistical analysis, and automated data analytics dashboards.
• Use machine learning or algorithmic tools to detect process drifts, predict equipment instability, and improve fault detection.
• Develop scripts or workflows to automate data extraction, analysis, and visualization for engineering insights.

Equipment & Operations Support

• Troubleshoot plasma etch and wet etch equipment issues, collaborating closely with equipment engineers and tool vendors.
• Support installation, calibration, chamber matching, and maintenance of etch systems (e.g., RIE, ICP, DRIE, isotropic/anisotropic wet etch tools).
• Drive continuous improvement to enhance tool uptime, wafer uniformity, and process repeatability.

Materials & Integration

• Evaluate material interactions, etch chemistries, mask selectivity, and post-etch surface conditions for integration with downstream processes.
• Conduct root-cause analysis on defects related to etch residue, profile distortion, microloading, and plasma damage.
• Work closely with integration, metrology, and reliability teams on material stack development and new device structures.

Documentation & Reporting

• Maintain detailed documentation including process recipes, SOPs, experiment records, yield and defect analysis, and improvement reports.
• Present technical results, data insights, and recommendations to R&D teams and management.

Job Requirements:

• Bachelor's or Master's degree in Materials Science, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Physics, or related fields.
• Hands-on experience with plasma etch (e.g., RIE, ICP, DRIE) or wet etch processes in semiconductor or advanced packaging environments.
• Proficiency in data analytics using Python, MATLAB, JMP, or similar statistical tools.
• Familiarity with AI/ML applications in process engineering (predictive models, cluster analysis, anomaly detection).
• Knowledge of SPC, DOE, and structured problem-solving methodologies (8D, FMEA, root-cause analysis).
• Experience working in cleanrooms, with strong understanding of semiconductor process flow and equipment safety.
• Strong analytical mindset, excellent problem-solving skills, and ability to manage complex datasets.