• Opportunity to work on future-generation process technologies
• Strong career progression pathways across R&D and HVM.

About Our Client

This is a global, top-tier semiconductor manufacturer with long-standing operations across R&D and high-volume manufacturing in the world. The organization is known for pushing process technology forward while maintaining a stable business footprint and deep partnerships. Engineers here work in fabs and development lines, collaborate across cross-functional, multi-site teams, and see their work translate into high-impact, widely deployed products. The culture values technical rigor, data-driven decisions, and continuous learning, offering clear pathways for technical growth and leadership.

Job Description

• Develop, optimize, and characterize dry etch processes for complex structures across multiple layers (oxide, nitride, polysilicon, carbon, metals).
• Engineer profile control, selectivity, etch-to-film interactions, critical dimension (CD) stability, and across-wafer uniformity.
• Conduct advanced DOE, SPC, and defect-based investigations to tighten process windows and improve stability.
• Work on HAR etch, trench/contact etch, slit/wave/wiring cuts, hard-mask patterning, and complex stacks.
• Evaluate plasma chemistry, ion/radical dynamics, RF tuning, and chamber conditions that influence profile consistency and line integrity.
• Own etch chambers through installation → qualification → release.
• Conduct chamber matching, hardware evaluation, seasoning strategy optimization, and new chemistry trials.
• Work closely with equipment suppliers on tool improvements, hardware upgrades, and module-level enhancements.
• Partner with Process Integration, Metrology, Thin Film, Photo, and Wet Process teams to ensure seamless module alignment.
• Support silicon builds, early process flow validations, and transfer-to-manufacturing milestones.
• Provide direction for long-term etch roadmap development.
• Mentor junior engineers, lead problem-solving sessions, and drive collaborative learning.
• Represent the module in cross-site technical alignment, reviews, and decision-making forums.

The Successful Applicant

• Hands-on experience with ICP, CCP, RIE, or advanced plasma etch systems used for semiconductor fabrication.
• Strong understanding of plasma chemistry, RF power control, ion directionality, polymer control, profile shape engineering, and etch uniformity.
• Familiarity with 300mm etch equipment from LAM, TEL, AMAT, or equivalent.
• Proficiency in DOE, SPC, FDC/ADC, root-cause analysis, and process window exploration.
• Experience using CD-SEM, XSEM, profilometry, OES endpoint systems, and inline metrology tools.
• Strong analytical thinking and structured problem-solving.
• Excellent communication for cross-functional alignment.
• Ability to manage multiple projects with high ownership.

What's on Offer

You can expect a high-impact engineering environment with the opportunity to contribute to advanced semiconductor process development alongside experienced technical leaders. The position offers access to cutting-edge tools, collaborative project work, and the ability to influence meaningful improvements within a core technology area. Engineers in this team benefit from a supportive growth framework, exposure to cross-functional problem-solving, and a pathway to expand both technical depth and organizational influence. Overall, it's an opportunity to work on challenging, forward-looking technologies within a stable and globally recognized industry setting.

Contact

Timothy Huang (Lic No: R1980928/ EA no: 18S9099)

Quote job ref

JN-012026-6918416

Phone number

+65 6416 9863