As a Research Engineer in the Wafer-to-Wafer (W2W) Bonding Module, you will work on Temporary Bonding and Debonding (TBDB) processes-an essential step in advanced semiconductor packaging for handling ultra-thin wafers. This role focuses on process development, optimization, and stabilization to enable next-generation packaging technologies.

Key Responsibilities:

• Developing and optimizing temporary bonding and debonding processes for wafer-level packaging.
• Support integration of process flows, ensuring compatibility across multiple steps in advanced packaging including laser debonding and back grinding.
• Investigate and resolve process issues and defects such as voids, warpage, and delamination.
• Plan and execute Design of Experiments (DOE) for process development.
• Collect, analyze data, and document findings in technical reports.

Job Requirements:

• Bachelor's degree in Materials Science, Mechanical Engineering, Physics, Chemistry, Electronics, or Electrical Engineering.
• Experience in TBDB process development or advanced packaging technologies is an advantage.
• Strong analytical and problem-solving abilities.
• Good communication and teamwork skills.
• Ability to work in a cleanroom environment and handle precision equipment.