Key Job Accountabilities (Actual daily deliverables):

• Perform line sustaining job function on set-up, conversion and equipment repair to support production loading.
• Develop creative and innovative solutions to problems with considerable initiatives and independent thoughts
• Communicate with Engineers and external vendors to resolve problems.
• Identify problems as well as areas for yield and quality improvements and develop methods to improve productivity and reduce manufacturing cost
• In-charge of ball drop, reflow, taping, detaping, wafer mounter, saw singulation process and open short and wafer probing testing.
• Experience in backend assembly process is preferred.
• Perform Preventive Maintenance for all Backend Operation Tools.

Required Experience and Qualifications (Required knowledge, skills and experience---however acquired):

• Diploma in Mechanical Engineering or equivalent
• Minimum 2 years of relevant experience in wafer bumping for backend operations.
• Ability to work on 12 hours rotating shift if required
• Had keen to share improvement equipment knowledge and further improve on machine design improvement through machine modification.