STATSChipPac is seeking a hardworking and passionate R&D Staff Engineer/Principal Engineer, with experience in Silicon Photonics advanced packaging, to realize next-generation optical interconnects for high-volume manufacturing. The candidate will join the Singapore R&D team and lead the packaging technologies development with universities and research institutes. The candidate will drive and bring Si photonics/chiplet packaging and co-package optics development, utilizing advanced packaging technologies, to scalable production. The development covers high efficient optical I/O module architecture, assembly, optical coupling design, materials and process for fiber packaging.

The candidate will report to the Vice President of R&D. The successful candidate will have demonstrated advanced packaging technologies expertise, program management, excellent communication skills, and ability to apply process-control and problem-solving methodologies to achieve business objectives.

Responsibilities:

• Responsible to lead packaging technology development and projects with universities/research institutes.
• Collaborate with cross-functional teams to enable scalable, manufacturable designs - define assembly baseline processes, decide package BOM, establish design/manufacturing (eg. optical coupling) that are optimized for performance, reliability, yield and cost.
• Work with customers, vendors and research institutes to bring packaging solution from concept to HVM.
• Research and create new technologies for emerging frontiers.
• Drive new technologies development for timely new product introduction and ramping of new technologies.
• Support project management and technical findings documentation through reports, reviews, or relevant forum presentations

Qualifications:

• Strong theoretical background in optics and photonics fundamentals, device/module integration.
• Hands-on experience in packaging and measuring fiber-coupled devices, preferably has hands-on experience in optical component design, simulation and qualification, and fiber assembly.
• M.S. or Ph.D. in Physics (Optics major), Material Science, Mechanical, Chemical or Electrical Engineering or related field.
• Minimum of 10 years of experience in semiconductor industry, including at least 5 years of experience in technical and/or project management.
• Familiar with wafer-level processing and packaging (such as CMP, TSV, CoW, advanced singulation) and interconnection assembly (such as hybrid bonding, CoWoS, CoPoS)
• Experience in designing test vehicle for reliability and performance assessment. Capable to troubleshoot and analyze the physics of failure.
• Strong cross-functional teamwork, collaboration, interpersonal, written and business skills. Good communication skills.