CoW Development Engineer
SSCK PTE. LTD.
11 hours ago
Posted date11 hours ago
N/A
Minimum levelN/A
EngineeringJob category
EngineeringPurpose of the Job:
Key Job Accountabilities:
Scope of the Job:
Required Experience and Qualifications:
- To support R&D activities for 2.5D wafer-level packaging (WLP) processes-including Die Preparation, Chip Attach, and Mold-focusing on process reliability, manufacturability, and integration for advanced semiconductor packages.
Key Job Accountabilities:
- Develop and optimize key 2.5D CoW (Chip-on-Wafer) processes: Die Preparation: grinding, laser grooving, dicing saw Chip Attach: TCB (Thermo-Compression Bonding), LCB (Laser Compression Bonding) Mold: compression or transfer mold for warpage and protection
- Perform material evaluation and reliability analysis (e.g., XRF, shear test)
- Conduct DOE/FMEA for robust process design and improvement
- Work closely with cross-functional teams (e.g., Bumping, RDL, Failure Analysis) to enable seamless process integration
- Track and analyze industry trends in equipment, materials, and technologies
- Support new product introduction (NPI) and yield ramp-up through structured problem-solving
- Document process flows, risk assessments, and engineering reports
Scope of the Job:
- Directly impacts production readiness, yield, and reliability of high-value 2.5D packages
- Supports NPI for advanced semiconductor customers (e.g., AI, HPC, and memory applications)
- Influences supplier qualification and capital decisions related to 2.5D tooling and materials
- Contributes to revenue generation through early ramp-up and stable process delivery
Required Experience and Qualifications:
- Bachelor's degree or higher in Engineering (Materials, Electronics, Chemical, Mechanical, or related field)
- 3+ years of hands-on experience in semiconductor packaging process development (Die Prep, Chip Attach, or Mold)
- Proficient in DOE, FMEA, statistical process control, and failure analysis
- Familiar with process and reliability evaluation tools (e.g., XRF, shear test, SAM)
- Skilled in documentation and cross-functional communication
- Experience in OSAT, Fab, or advanced packaging (e.g., 2.5D/3D, HBM, interposer) (Preferred)
JOB SUMMARY
CoW Development Engineer
SSCK PTE. LTD.
Singapore
11 hours ago
N/A
Full-time
CoW Development Engineer