• Position title : TCB (Thermo Compression Bonding) Design Engineer - Die Ejection Systems (Thin Die & CoW Packages)
• Location: Admiralty
• Working Days: 5 Day A Week
• Working hours : 9:00am - 6:00pm
• Salary : $6000 - $8000 (depends experience)

Interested applicants can also send your resume to WA: +65 8827 8712 (Ms Lynne) and allow our Consultant to match you with our Clients. No Charges will be incurred by Candidates for any service rendered.

TAN LEE XIAN Reg No: R24123487

The Supreme HR Advisory Pte Ltd EA No: 14C7279

Role Overview
We are seeking a Mechanical Design Engineer with expertise in designing die ejection modules for semiconductor packaging equipment. The candidate should have hands-on experience in ejecting ultra-thin dies (down to 25 µm) from wafers and familiarity with Chip-on-Wafer (CoW) package handling for CoWoS assembly. This role demands a deep understanding of stress, warpage, and material behavior during the ejection process to achieve high yield and prevent die damage.

Key Responsibilities

• Lead the design of die ejection modules capable of handling ultra-thin dies (≤ 25 µm).
• Develop mechanical tooling and systems to minimize stress, die cracking, or chipping during ejection.
• Incorporate simulation-based validation (FEA) for warpage, stress, and deformation analysis.
• Design ejection solutions that effectively mitigate residue-related yield loss from wafer dicing tape.
• Collaborate with motion, control, and vacuum subsystems to ensure synchronized ejection and pick-up.
• Work closely with process engineers to optimize ejection force, tape adhesion parameters, and throughput.
• Design ejector modules for large and warped CoW packages used in CoWoS and 2.5D packaging applications.
• Develop robust tooling concepts to manage thermal and mechanical stress during CoW ejection.
• Analyze yield loss due to ejection-related defects and implement design or process improvements.
• Support cross-functional teams in root-cause analysis and failure prevention.

Requirements

• Bachelor's or Master's degree in Mechanical Engineering, Mechatronics, or related field.
• 5+ years of experience in semiconductor equipment design, preferably in die handling or ejection systems.
• Strong background in mechanical stress analysis, warpage modeling, and precision tooling design.
• Proficiency with SolidWorks, Creo, or equivalent 3D CAD software.
• Experience with FEA tools (ANSYS, COMSOL, etc.) for stress and deformation analysis.
• Familiarity with cleanroom design requirements, vacuum systems, and precision motion stages.
• Prior involvement in CoWoS, 2.5D, or HBM packaging processes.
• Hands-on experience with tape residue management, die pick-up optimization, or die attach automation.
• Knowledge of wafer dicing, plasma cleaning, and surface preparation techniques.
• Experience collaborating with process, electrical, and software teams in semiconductor tool development.