• TCB (Thermo Compression Bonding) Design Engineer (Fluxless) - Oxygen & Environmental Control Systems
• Location: Admiralty
• Working Days: 5 Day A Week
• Working hours : 9:00am - 6:00pm
• Salary : $6000 - $8000 (depends experience)

Interested applicants can also send your resume to WA: +65 8827 8712 (Ms Lynne) and allow our Consultant to match you with our Clients. No Charges will be incurred by Candidates for any service rendered.

TAN LEE XIAN Reg No: R24123487

The Supreme HR Advisory Pte Ltd EA No: 14C7279

Role Overview
The Mechanical Design Engineer will be responsible for designing systems to control and optimize oxygen levels during Thermal Compression Bonding (TCB) processes for advanced semiconductor packaging . The role involves working with inert gas environments (Nitrogen systems), Formic Acid vapor handling, Clean Room integration, and Plasma-based oxide removal systems . The position requires cross-functional collaboration to ensure process stability, safety, and performance.

Key Responsibilities

• Design and develop oxygen control and purge systems for TCB equipment to achieve ultra-low oxygen environments.
• Develop nitrogen and formic acid gas delivery systems ensuring safety, flow uniformity, and chemical compatibility.
• Design plasma cleaning systems for oxide removal on incoming wafers and substrates prior to bonding.
• Integrate gas handling, exhaust, and pressure control modules within bonder chambers.
• Ensure compliance with cleanroom standards and contamination control requirements.
• Conduct CFD and thermal analysis to evaluate gas flow, heat distribution, and oxygen diffusion during bonding.
• Select appropriate materials for components exposed to formic acid, plasma species, and high temperatures.
• Develop safety interlocks and control schemes for handling flammable or corrosive gases.
• Collaborate with process, equipment, and controls engineers to align designs with process needs.
• Support installation, commissioning, and troubleshooting at customer or manufacturing sites.

Requirements

• Bachelor's or Master's degree in Mechanical Engineering or related discipline.
• Minimum 5+ years of experience in precision equipment design for semiconductor, display, or vacuum systems.
• Experience with oxygen and humidity control, nitrogen purge, and formic acid vapor systems.
• Experience with plasma cleaning or surface activation systems.
• Proficiency in 3D CAD tools (SolidWorks, Creo, or NX) and thermal/flow simulation tools (ANSYS, COMSOL).
• Understanding of chemical compatibility, gas flow control, and vacuum-sealing techniques.
• Familiarity with TCB, CoWoS, or hybrid bonding environments preferred.
• Experience with mass flow controller (MFC) calibration and integration.
• Knowledge of oxidation kinetics and surface chemistry in bonding processes.
• Familiarity with automation and control systems (PLC, sensors, feedback loops).
• Experience with cleanroom mechanical design and safety certifications.