As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron's latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI's Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You will also collaborate with cross functional team (Fab, Product Leads, Design, Technology Development, Design, Test Solution Engineering etc) with diverse expertise to achieve both strategic and tactical objectives and stay ahead on technology and product leadership. The future of HBM are exciting and dynamics. Micron is seeking experienced individuals that find technical challenges engaging and invigorating.

Responsibilities:

• Optimized Test Coverage: The responsibility of ensuring optimized test coverage on all current and future HIG HBM design architectures and process nodes is a technical aspect of this role. This is crucial for maintaining the effectiveness and efficiency in high-volume manufacturing.
• Product Development and Validation: This role is pivotal in developing, validating, characterizing, and qualifying Micron's next-generation HBM products. Ensuring that these products are reliable and meet the necessary standards is a technical task that directly impacts the market readiness of the products.
• Support for New Product Design Validation: The role provides support for design verification and in-depth circuit of new products using CAD tools and Verilog simulations. This technical support is crucial for the development of new products and technologies.
• Yield Improvement and Cost Reduction: The role involves technical tasks like improving manufacturing test yields (Specifically related to Device Issues from the DRAM, Interface and Stacked Die Yield), reducing test time, and resolving yield-related issues. These activities are critical for cost reduction and meeting yield targets.
• Root Cause and Resolution of Manufacturing Test Flow Issue, Qual and RMA Device Issues
• Promotion of Innovation: The role involves promoting innovation and driving for changes that will provide Micron with a technical advantage over its competition. This is vital for maintaining Micron's competitive edge in the market.
• Mentorship and Development of Others: The role involves actively developing and mentoring others. This is important for the growth and development of the team and the organization.
• Project Management: Developing project management skills within the team ensures efficient execution of projects, leading to timely delivery of technological solutions.
• Technical Decision Making: The role involves making final decisions on risk analysis and project prioritization. These decisions directly impact the direction of technological development.
• Cross-Functional Collaboration: This role necessitates collaboration with various cross-functional teams such as Fab, HBM Technology Development, HBM Design, System Development, and Quality/Reliability team. This collaboration is vital for the holistic development and shipping of end products.

Requirements

• Bachelor's or Master's degree in Electrical and Electronics Engineering or a related field.
• Coursework or internship experience in semiconductor devices, circuit design, or product validation is a plus.
• Solid understanding of problem-solving methodologies, with a focus on identifying root causes and exploring solution spaces.
• Familiarity with CMOS technology, DRAM architecture, and basic device physics.
• Exposure to data analysis, statistics, and scripting tools such as Python or JMP.
• Strong attention to detail and a commitment to quality.
• Ability to work effectively in team-based projects, contributing to shared goals and outcomes.
• Flexible and eager to learn, with a willingness to take on diverse roles in a dynamic engineering environment.
• Responsible and accountable, with a professional work ethic and ownership of assigned tasks.
• Clear and effective communication skills in written and spoken English, especially when articulating technical concepts and findings

Performs hardware, software, semiconductor design or telecomm engineering assignments. This job mapping should be used only if the position cannot be mapped specifically to other design/development engineering jobs.