As a pathfinding NVM Technology Process Integration engineer at Micron Technology, Inc., you will be part of a world-wide team responsible for defining and driving next-generation technology from R&D to high volume manufacturing. You will be responsible for leading a multi-disciplinary team of engineers to deliver industry leadership for performance and cost with aggressive timelines.

Responsibilities

• Lead ownership of one or more process modules or alternative flows, including structural development, electrical performance, process control, and manufacturability assessment.
• Define clear module direction and implement a continuous improvement plan, proactively identifying and resolving potential issues.
• Conduct electrical and physical material analysis; collaborate with cross-functional teams to evaluate and select new materials for development.
• Assemble and guide a multidisciplinary development team (e.g., process engineers, yield engineers), securing wafer resources and setting clear goals, metrics, and decision-making frameworks.
• Drive process development and integration through well-designed experiments; analyze and report data with statistical rigor to inform conclusions.
• Apply innovative problem-solving approaches grounded in first principles, materials science, and technical analysis; contribute to patent disclosures and leverage technical literature to guide research.
• Demonstrate technical insight into scaling challenges and provide strategic direction.
• Communicate effectively through presentations and group discussions to support informed decision-making and team alignment.

Job Requirements

Qualifications

• PhD or M.S. in Electrical Engineering, Microelectronics, Physics, or Materials Science and Engineering, with at least 7 years of relevant industry experience for an M.S. or at least 4 years for a Ph.D.
• Prior integration and cross-functional project management experience highly preferred.

Selection Criteria

• Ability to derive construction specifications based on correlating electrical and inline metrics based on unit processes and design rules.
• Ability to design, execute and analyze experiments necessary to meet engineering specifications based on structure to electrical correlations, or on the need to attain product specifications such as speed, reliability, power, cost, etc., in the absence of these correlations.
• Ability to solve problems with a model-based approach and drive technical innovation through process improvements, patents or technical papers.
• Understand semiconductor device physics and electrical characterization methods including probe, ESDA, param and reliability.
• Understand test structure definition, layout, and electrical testing as it pertains to assigned process module.
• Experience in data analysis through JMP, Python or other data engineering software.
• Strong interpersonal, oral and written English communications-skills.