About the role:

Support application validation activities across PDP, CD, and TD projects to ensure robust product performance and reliability. Generate comprehensive engineering data to facilitate customer presentations and demonstrate the capabilities of new products.

Job Responsibilities:

• Welco T6/T7/T8+ support for Paste Development and Application Validation on PDP stages (G2 to G5)
• Conducting Advanced package tacky flux application validation for product development from PDP G2 to G5 and Advanced package CD project application test validation from Stage B to C
• Leading the Best-Known Methodology project for subject matter experts on Welco Solder paste product
• Collaborating on projects related to functional excellence.
• Operational support for second source raw materials / EOL chemicals
• Support the Preventive maintenance of equipment and Test vehicle and stencil inventory

Job Requirement:

• Master's or bachelor's degree in engineering (Materials, Mechanical, Electrical & Electronics, Physics, or Chemistry preferred).
• 2 years of experience in solder/assembly materials for semiconductor applications.
• Better understanding or learning about semiconductor backend process like stencil printing, Dispensing, Flip chip, die attach and reflow process.
• Ability to handle the dispensing, stencil printing, die attach, and flip chip bonding equipment.
• Provide technical support to internal teams and external customers during new product implementation.
• Proficiency in standard business and engineering tools (e.g., JMP, Minitab, SPC, DOE, 5-Why, 5M+1E, etc..) and Microsoft Office applications.
• Hands-on experience with equipment such as ASM DEK printer, ASM SiPlace, Besi Datacon, ESEC Die Bonder, and Musashi dispensing platforms is highly desirable.