Scientist (Multi Chiplet Heterogeneous Integration and High-Speed IO Designer), (SiP), IME
A*STAR RESEARCH ENTITIES
7 days ago
Posted date7 days ago
N/A
Minimum levelN/A
We are seeking a highly skilled Electrical Modeling, Applied Machine Learning engineer to join our team. The ideal candidate will have a strong background in Electrical or Computer Engineering (PhD), with a focus on applied machine learning in advanced package physical design, high speed circuit modeling, design technology co optimization or system technology co optimization and analysis, signal / power integrity. The successful candidate will play a crucial role in developing accelerating simulation and analysis technology towards design enablement of state-of-the-art advanced packaging.
Key Responsibilities:
Required Qualifications:
Preferred Qualifications:
Key Responsibilities:
- Develop performance models, feature engineering of Electrical /Thermal / Mechanical analysis of multi chiplet advanced packages
- Collaborate with cross-functional (Electrical, Thermal and Mechanical) package design and analysis teams to ensure solid understand of the analysis parameters, input / outputs
- Data wrangling, EDA format parsing, generating custom databases for specific electrical, thermal and mechanical domain.
- Perform benchmarking of various applicable AI / ML algorithm and Design of Experiments.
- Integrate the AI / ML solution within the design flow for training and inference, develop and maintain data pipeline.
- Participate in comprehensive literature survey on diffusion models, reinforcement learning, PINN, language models and identify areas of applicability for advanced packaging electrical physical design, thermal integrity and mechanical reliability analysis
- Stay up to date with the latest advancements, improve existing models, develop new ones and propose new applicable architectures.
Required Qualifications:
- PhD in Electrical or Computer Engineering with relevant experience.
- Understanding of advanced packaging /interconnect/I-O modelling, statistical analysis, signal/power integrity, thermal flow, stress and yield factors in advanced packaging.
- Experience and Proficiency in Python, Tensorflow, Scikit, statistical packages, database SQL/no-SQL, postgresSQL, vector databases.
- Programming and scripting skills in one or more of the following: Python, Perl, C/C++, TCL, or AEL.
Preferred Qualifications:
- Ability to research, develop and implement AI/ ML algorithms using industry-standard open-source tools/methodologies.
- Strong problem-solving skills and the ability to think creatively to overcome technical challenges for cross domain implementations.
- Excellent communication and collaboration skills, with the ability to work effectively in a team environment.
JOB SUMMARY
Scientist (Multi Chiplet Heterogeneous Integration and High-Speed IO Designer), (SiP), IME
A*STAR RESEARCH ENTITIES
Singapore
7 days ago
N/A
Contract / Freelance / Self-employed
Scientist (Multi Chiplet Heterogeneous Integration and High-Speed IO Designer), (SiP), IME