Process Engineer - Assembly Process (Up to 4.6K | Flex PCB) 

Process Engineer - Assembly Process (Up to 4.6K | Flex PCB) 

Location: Serangoon

Working hour: Monday to Friday 8.30am to 6pm

Responsibilities: 

• To assist in the full product development cycle of new product, by verifying new product concept, producing prototype, testing new products and necessary qualifications
• To conduct New Product Introduction, and provide technical support and necessary supportive documentations to operation team
• Responsible for Flip-chip ACP assembly Process optimization & improvement
• To provide assistance & guidance during product industrialization.
• Evaluation & qualification of new materials

Requirements:

• Min Diploma in Electrical or Mechanical Engineering with min. 3 years relevant working experiences,
• Preferred with practical experience in RFID, Knowledge of antenna & RF circuit designs,
• Technical and specialized knowledge or experience in Semi-conductor and/or flex-PCB industry, hands-on experiences with flip-chip assembly machines will be advantage,
• Knowledge of AutoCAD is plus.

If you are excited by the above opportunity and challenges and enjoy making things happen, do apply now!
OR
Email your resume to:
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Wyman Low
Associate Team Lead
Low Yong Wei (Wyman) - R1550983
ScienTec Consulting Pte Ltd - 11C5781