GMP RECRUITMENT SERVICES (S) PTE LTD

Development Engineer (Semiconductor Package Solutions)

GMP RECRUITMENT SERVICES (S) PTE LTD| Date Posted: 4-Jun-2021
EA Licence No: 09C3051|EA Personal Registration No: R1104671
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Job Nature:
Permanent
Position Level:
Experienced, Manager
Qualification:
Bachelor's / Honours, Masters / PhD

Job Description

Job Functions:

  • New Product Introduction and production sustaining in the area of the back end assembly.
  • In direct collaboration with business units , RnD and assembly manufacturing sites to:
  1. Develop assembly solutions and ensure the product qualification.
  2. Meet the target with the highest level of quality and cost using optimized technology processes.
  3. Propose and implement innovative steps to enhance the manufacturability and yields.
  4. Provide technical support in rapid closure of quality issues with identified root cause and corrective actions to prevent recurrences.

 

Requirements:

  • Degree in Mechanical Engineering or Material Science
  • 5 years of more of relevant technology solutions development experience
  • Knowledge of mechanical assembly processes and industrial engineering in the semiconductor ecosystem is preferred
  • Strong team work abilities in a multicultural environment (South east Asia, China, Europe and North America)
  • Mastery in DOE and 6 sigma approach allowing to put into application general knowledge in physic, electronic, engineering and statistical tool
  • Service-minded and a high level of autonomy and leadership

 

To apply, please click "Apply Now" or visit www.gmprecruit.com and search for job reference: 18033

We regret that only shortlisted candidates will be notified.

 

GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Tan Wai Peng | Registration No: R1104671

Company Overview
GMP RECRUITMENT SERVICES (S) PTE LTD