Associate Engineer (Wire-bonding)

ST Engineering Land Systems Ltd. | Date Posted: 13-Feb-2019
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Position Level:
Entry Level, Experienced, Manager, Senior Manager, Top Management, Student Job
Qualification:
'N' Levels / 'O' Levels, ITE/ NITEC/ Higher NITEC, 'A' Levels, Diploma, Bachelor's / Honours, Masters / PhD

Job Description

Company: ST Electronics (Satcom & Sensor Systems) Pte Ltd
Business Area: Electronics


Job Description:


  • To operate die attachment machine with minimum supervision.
  • To perform visual inspection and bond pull test to verify the bonding parameter.
  • To perform wire bonding according to assembly drawing.


Job Requirement:

  • Diploma in any discipline 
  • 2 or more years of working experience ( advantage )
  • Able to work independently
(We regret that only shortlisted candidates will be notified.)