Assembly Equipment Engineer (Wire Bond)

Micron Semiconductor Asia Date Posted: 4-Aug-2017

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Job Description

Req. ID: 90534 

Responsibilities

  • Identify, diagnose and resolve equipment related problems and responsible for the overall equipment performances, i.e. UTIL, AVAILABILITY etc.
  • Define equipment maintenance programs to sustain continuous operation for production
  • Implement continuous improvement programs / activities on equipment to improve tool operational safety, performances, minimize losses and maintenance cost
  • Work with equipment and automation vendors to setup machine and material automatic handling capabilities.
  • Lead / participate in equipment benchmarking and definition of Tool of Record (TOR)
  • Participate in cross functional team activities to achieve overall production yield, quality and cost goals
  • Lead / coordinate new equipment installation and production release, incl. buyoff, training, etc.
  • Provide support to manufacturing 24x7 operation and ensure maximum equipment uptime to meet weekly production targets.
  • Interface with process engineering to develop and support new processes and applications.
  • Work with equipment and automation vendors to setup machine to material handling functionality.
  • Support internal and external audits.

Requirements

  • Bachelor Degree Holder in Mechanical or Mechatronic Engineering or
  • Diploma holder in Mechatronics or Mechanical Engineering or other relevant fields with relevant experiences in the high-tech manufacturing environment
  • Good communication and interpersonal skills with a strong interest in working in a dynamic environment
  • Fast learner, with initiative and independence (min supervision)
  • Familiar with trouble shooting skill, root cause analysis techniques, FMEA, QC tools
  • Knowledge in basic mechatronic, electricity, fluid dynamics, thermodynamics, sound and vibration and mechanics of material
  • Candidates with equivalent experience may be considered for senior position
  • Candidates with Wafer Backend packaging in Wire Bonding equipment and process knowledge will be preferred.


We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.


Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.


To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).


Keywords:  Singapore || Central Singapore (SG-01) || Singapore (SG) || Backend Manufacturing || Experienced || Regular || Engineering || Not Applicable ||
 


Job Segment: Assembly, Manufacturing Engineer, Engineer, Mechanical Engineer, Process Engineer, Manufacturing, Engineering

Req. ID: 90534 

Responsibilities

  • Identify, diagnose and resolve equipment related problems and responsible for the overall equipment performances, i.e. UTIL, AVAILABILITY etc.
  • Define equipment maintenance programs to sustain continuous operation for production
  • Implement continuous improvement programs / activities on equipment to improve tool operational safety, performances, minimize losses and maintenance cost
  • Work with equipment and automation vendors to setup machine and material automatic handling capabilities.
  • Lead / participate in equipment benchmarking and definition of Tool of Record (TOR)
  • Participate in cross functional team activities to achieve overall production yield, quality and cost goals
  • Lead / coordinate new equipment installation and production release, incl. buyoff, training, etc.
  • Provide support to manufacturing 24x7 operation and ensure maximum equipment uptime to meet weekly production targets.
  • Interface with process engineering to develop and support new processes and applications.
  • Work with equipment and automation vendors to setup machine to material handling functionality.
  • Support internal and external audits.

Requirements

  • Bachelor Degree Holder in Mechanical or Mechatronic Engineering or
  • Diploma holder in Mechatronics or Mechanical Engineering or other relevant fields with relevant experiences in the high-tech manufacturing environment
  • Good communication and interpersonal skills with a strong interest in working in a dynamic environment
  • Fast learner, with initiative and independence (min supervision)
  • Familiar with trouble shooting skill, root cause analysis techniques, FMEA, QC tools
  • Knowledge in basic mechatronic, electricity, fluid dynamics, thermodynamics, sound and vibration and mechanics of material
  • Candidates with equivalent experience may be considered for senior position
  • Candidates with Wafer Backend packaging in Wire Bonding equipment and process knowledge will be preferred.


We recruit, hire, train, promote, discipline and provide other conditions of employment without regard to a person's race, color, religion, sex, age, national origin, disability, sexual orientation, gender identity and expression, pregnancy, veteran’s status, or other classifications protected under law.  This includes providing reasonable accommodation for team members' disabilities or religious beliefs and practices.


Each manager, supervisor and team member is responsible for carrying out this policy. The EEO Administrator in Human Resources is responsible for administration of this policy. The administrator will monitor compliance and is available to answer any questions on EEO matters.


To request assistance with the application process, please contact Micron’s Human Resources Department at 1-800-336-8918 (or 208-368-4748).


Keywords:  Singapore || Central Singapore (SG-01) || Singapore (SG) || Backend Manufacturing || Experienced || Regular || Engineering || Not Applicable ||
 


Job Segment: Assembly, Manufacturing Engineer, Engineer, Mechanical Engineer, Process Engineer, Manufacturing, Engineering

Company Overview

Micron Semiconductor Asia
Micron Technology is a world leader in memory and semiconductor technology. We offer the industry’s broadest portfolio of silicon-to-semiconductor solutions starting with foundational DRAM, NAND, and NOR Flash memory, and extending to SSDs, modules, MCPs, HMC, and other semiconductor solutions. For more than 38 years, Micron has dedicated itself to collaborating with customers and partners to engineer technology that drives innovation and transforms what’s possible. We continually rethink, recast, and advance new ideas to make it easier for customers to try new things and gain competitive advantages in their markets.